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For all questions about the ceramic substrate, please contact by mail ctceramic.amb@gmail.com
Items/Types | AlN Aluminum Nitride | Unit |
---|---|---|
Density | 3.3 | g/m3 |
Thermal Conductivity | >170 | W/m * K |
Coefficient of Thermal Expansion | 4.7 (20℃~300℃) | * 10-6/K |
Bending Strength (Σ0,M>10) | >350 | MPa |
Dielectric Loss | 0.0005 | 1MHz |
Dielectric Constant | 9.0 | 1Mhz |
Dielectric Strength | >20 | KV/mm |
Electrical Resistivity | >1014 | Ω *cm |
E-Modulus | 320 | GPa |
Items | Parameters | Unit |
---|---|---|
Purity | 99.99 | % |
O2 Content | OFHC | – |
Hardness | 60~110 | HV |
Electrical Conductivity | 58.6 | MS/m |
CERAMIC THICKNESS | AIN |
---|---|
0.25mm | ✔ 4”* 4” |
0.38mm | ✔ 5”* 5” |
0.63mm | ✔ 5,5”* 7,5” |
1.0mm | ✔ 5,5”* 7,5” |
0.20mm | 0.30mm | 0.50mm | 0.80mm |
CERAMIC THICKNESS | COPPER THICKNESS |
---|
0.20mm | 0.30mm | 0.50mm | 0.80mm | |
---|---|---|---|---|
0.25 mm | AlN | AlN | – | – |
0.38 mm | AlN | AlN | AlN | – |
0.63 mm | AlN | AlN | AlN | – |
1.00 mm | AlN | AlN | AlN | AlN |
For all questions about the ceramic substrate, please contact by mail ctceramic.amb@gmail.com
COPPER THICKNESS | SPACINGS | MIN. PITCH |
---|---|---|
0.20mm | 0.35mm | 0.7mm |
0.30mm | 0.55mm | 0.9mm |
0.50mm | 0.65mm | 1.1mm |
0.80mm | 1.10mm | 2.0mm |
COPPER THICKNESS | DISTANCE |
---|---|
0.20mm | A≥0.20mm |
0.30mm | A≥0.30mm |
0.50mm | A≥0.40mm |
0.80mm | A≥0.50mm |
DISTANCE |
---|
M≤0.2mm |
ETCHING FACTOR |
---|
F=T/A>2 |
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