Ceramic substrates AMB technology (Active metal brazing).

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For all questions about the ceramic substrate, please contact by mail ctceramic.amb@gmail.com

1. MATERIAL PROPERTIES

Items/TypesAlN Aluminum NitrideUnit
Density3.3g/m3
Thermal Conductivity >170 W/m * K
Coefficient of Thermal Expansion 4.7 (20℃~300℃) * 10-6/K
Bending Strength (Σ0,M>10) >350 MPa
Dielectric Loss 0.0005 1MHz
Dielectric Constant 9.0 1Mhz
Dielectric Strength >20 KV/mm
Electrical Resistivity >1014 Ω *cm
E-Modulus 320 GPa

1.02 COPPER PROPERTIES

ItemsParameters Unit
Purity 99.99 %
O2 Content OFHC
Hardness 60~110 HV
Electrical Conductivity 58.6 MS/m

1.03 AVAILABLE CERAMIC TYPES/THICKNESSES

CERAMIC THICKNESS AIN
0.25mm ✔ 4”* 4”
0.38mm ✔ 5”* 5”
0.63mm ✔ 5,5”* 7,5”
1.0mm ✔ 5,5”* 7,5”

1.04 COPPER THICKNESSES

0.20mm 0.30mm0.50mm0.80mm

1.05 AVAILABLE MATERIAL THICKNESS COMBINATIONS

CERAMIC THICKNESS COPPER THICKNESS
0.20mm 0.30mm0.50mm 0.80mm
0.25 mm AlNAlN
0.38 mmAlNAlNAlN
0.63 mm AlNAlNAlN
1.00 mm AlNAlNAlN AlN

For all questions about the ceramic substrate, please contact by mail ctceramic.amb@gmail.com

2. DESIGN FEATURES

2.01 PATTERN MIN. WIDTH/SPACING DIMENSION

COPPER THICKNESS SPACINGS MIN. PITCH
0.20mm 0.35mm 0.7mm
0.30mm 0.55mm 0.9mm
0.50mm 0.65mm 1.1mm
0.80mm 1.10mm 2.0mm

2.02 CERAMIC EDGE PERIMETER

COPPER THICKNESS DISTANCE
0.20mm A≥0.20mm
0.30mm A≥0.30mm
0.50mm A≥0.40mm
0.80mm A≥0.50mm

2.03 MISALIGNMENT COPPER PATTERN FRONT/BACK

DISTANCE
M≤0.2mm

2.04 ETCHING FACTOR

ETCHING FACTOR
F=T/A>2

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